Master Lithography Processes for Advanced Semiconductor & Nano Fabrication
Lithography Engineer Course
- Industry Standard Tools
- Placement Assistance
- Course Certificate
- Weekly Mock Interviews
- Assignments After Modules
- Industry-Standard EDA Tools
New Batch Starts From
Coming Soon
Start Date
Duration
6 Months
Training Type
Offline Classes
Course Overview – Nano Fabrication Lithography Program
The Nano Fab Process Engineer Course focuses on the end-to-end semiconductor manufacturing cycle, from raw silicon wafer preparation to final device fabrication.
You will gain in-depth knowledge of:
Semiconductor materials & physics
Cleanroom protocols
Lithography, deposition, etching & diffusion
Process monitoring, control, and yield improvement
Equipment basics used in fabrication facilities
This program bridges the gap between theoretical semiconductor concepts and practical fab-level execution.
Why Choose the Lithography Engineer Course at ChipXpert?
- Curriculum aligned with real FAB lithography workflows
- Strong focus on process fundamentals + practical execution
- Training by experienced semiconductor professionals
- Emphasis on overlay, CD control, defects & yield
- Ideal for core fab, manufacturing, and process roles
- Career-focused approach with industry exposure
Key Learning Outcomes
By the end of this course, you will be able to:
- Understand lithography’s role in IC fabrication
- Work with photoresists, masks, and exposure systems
- Optimize process parameters for CD and overlay
- Identify and analyze lithography defects
- Apply SPC and process control methods
- Follow cleanroom safety & contamination control
- Prepare for Lithography Engineer roles in fabs
Course Fee
EMI Option
Merit Based Discount Option Upto 60%
Course Delivery Model
- Industry-Standard EDA Tools
- Offline Classroom Training
- Recorded Sessions on elearn Portal
- 24x7 Live WhatsApp Doubt Support
- Hands-On Lab Sessions
Course Duration & Timings
- Duration: 6 Months (Mon-Fri)
- Offline (Live + Recorded)
- Support: 24x7 Mentor Assistance
- Placement Assistance
Nano Fabrication – Fabrication & Lithography
Course Syllabus
- Role of lithography in semiconductor manufacturing
- Lithography engineer responsibilities
- Overview of CMOS process flow
- Technology nodes and scaling challenges
- Cleanroom classes and protocols
- Lithography bay layout
- Contamination sources and control
- Safety: chemicals, UV, lasers
- Wave optics basics
- Resolution, depth of focus
- Numerical aperture (NA)
- Rayleigh equation and limits
- Mercury lamp systems
- DUV lithography (248nm, 193nm)
- Immersion lithography
- EUV lithography overview
- Mask types and materials
- Mask fabrication flow
- OPC and RET concepts
- Mask inspection and defects
- Spin coating physics
- Soft bake & post-exposure bake
- Hot plates vs ovens
- Process uniformity control
- Stepper and scanner operation
- Alignment techniques
- Overlay control
- Focus and dose optimization
- Photoresist development chemistry
- Developer types
- Rinse and dry techniques
- Defect generation mechanisms
- Off-axis illumination
- Phase shift masks
- OPC fundamentals
- Double patterning concepts
- Multiple patterning (LELE, SADP, SAQP)
- Nanoimprint lithography
- E-beam lithography basics
- Directed self-assembly (DSA)
- EUV source generation
- Reflective optics
- EUV masks and pellicles
- EUV challenges and defects
- Critical dimension (CD) control
- Overlay metrology
- Focus exposure matrix (FEM)
- SPC for lithography
- Common lithography defects
- Root cause analysis
- Yield impact
- Troubleshooting methodologies
- CD-SEM
- Scatterometry
- Overlay measurement tools
- Defect inspection systems
- Pattern transfer considerations
- Resist-etch interaction
- Hard masks
- Integration challenges
- Stepper/scanner subsystems
- Preventive maintenance
- Tool matching
- Uptime and productivity
- Recipe development
- DOE for lithography
- Process window optimization
- Documentation and reporting
- SEMI standards
- Fab documentation
- Change management
- Safety and compliance
- Lithography process flow design
- CD and overlay optimization project
- Defect reduction case study
- Final technical report
Join us
Who should join this course?
- Fresh Engineering graduates ECE/EEE/Instrumentation/Telecom/CSE/Mechatronics
- BE/ B. Tech Students from 8th Semester can also enroll.
- M.Tech (VLSI/Embedded/Power Electronics) Freshers and students
Payments
- Pay through Debit card/ Credit card/ Net banking/ UPI.
- upto 60% Discount*
- EMI options are available. Ask the admissions team for the current EMI terms.
- Ask the admissions team for the current EMI terms.
Admission Procedure
Step 1: Online Admission Test
Take online test for 90 mins with 60 MCQs. Syllabus includes Aptitude, Digital Electronics, Electronic Devices.
Step 2: Seat Confirmation
Enroll in the course, if selected. Start your preparation by getting access to the pre-requisite materials.
Placement Coordinator
Placement Assistance
At ChipXpert VLSI Training Institute, our Placement Desk is dedicated to bridging the gap between skilled engineers and top-tier VLSI companies. The placement desk tracks entry-level openings at semiconductor product and service companies and helps trained engineers prepare for them.
We offer comprehensive placement assistance as part of our training package. From resume building and interview preparation to arranging direct interviews with hiring companies, our support continues through your job search. Additionally, we stay in constant touch with recruiters to ensure our students are matched with roles that best suit their skills and aspirations.
Our placement desk also offers personalized guidance for job seekers, including industry-specific tips and insights to help them excel during interviews. Candidates are encouraged to register with the placement desk for dedicated support throughout their job search. For further details or to start the placement process, please reach out to our Learning Advisor.
FAQ
Nano Fabrication - Lithography Engineer Course
The Nano Fabrication – Lithography Engineer Course is a specialized training program focused on photolithography processes used in semiconductor fabrication. It covers photoresist materials, mask fundamentals, exposure systems, process control, and defect analysis required for lithography roles in semiconductor fabs.
This course is ideal for B.Tech, M.Tech, and MSc students from ECE, EEE, Physics, Nanotechnology, as well as fresh graduates and professionals aiming to work as Lithography Engineers or Process Engineers in semiconductor fabrication facilities.
No prior lithography or fab experience is required. The course starts with fundamentals and gradually advances to fab-level lithography concepts, making it suitable for beginners and freshers.
You will gain knowledge of photoresist chemistry, mask alignment, exposure techniques, critical dimension (CD) control, overlay management, lithography defect analysis, and process optimization used in real fab environments.
This course bridges the gap between academic theory and fab practices by focusing on industry-relevant lithography processes, tools, and troubleshooting techniques, helping learners become job-ready for semiconductor fabrication roles.
Why Choose ChipXpert
Online VLSI Lab
Industry CAD Tools
